Super Precision Dicing Saw for Wafer Cutting Ds623

• Application: Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
• Type: Fixed
• Power Source: Servo Motor+Step Motor
• Model NO.: Dicing Saw DS623
• Condition: New
• Workpiece Size: Φ160mm ≤150mm X 150mm
• Groove Depth: ≤4mm or Customize
• Alignment System: 70X Straight Light + Ring Light(240X Optional)
• Spindle: Revolution Speed Range: 10000~50000 Rpm
• Spindle: Output Power: 1.5kw (2.4kw Optional)
• X Axis: Feed Speed Range: 0.1~500mm/S
• Y Axis: Single-Step Accuracy: ≤0.002mm/5mm
• Z Axis: Repeatability Accuracy: 0.002mm
• Power Supply: Single Phase, AC220V±10%
• Power Consumption: 0.8kw (Processing); 0.7kw (Warming up)
• Transport Package: Standard Export Packing
• Specification: 580mm× 850mm× 1680mm; 500kg
• Origin: China
• HS Code: 84862090
• Production Capacity: 200+ Sets/Year

Product Description