Precision Dicing Saw for 6", 8", 10", 12" Wafer Cutting for PCB, Silicon, Wafer

• Application: Blue Glass, Silicon, GaAs, PCB, Ceramic, Sapphire
• Type: Fixed
• Power Source: Servo Motor+Step Motor+Dd Motor
• Model NO.: DS623, DS820, DS830
• Customized: Customized
• Condition: New
• Workpiece Size: Φ200mm 180mm (for Square)
• Groove Depth: ≤4mm or Customize
• Alignment System: 70X Straight Light + Ring Light(210X Optional)
• Spindle: Revolution Speed Range: 10000~50000 Rpm
• Spindle: Output Power: 1.5kw
• X Axis: Feed Speed Range: 0.1~400mm/S
• Y Axis: Single-Step Accuracy: ≤0.003mm/5mm
• Z Axis: Repeatability Accuracy: 0.002mm
• Power Supply: Single Phase, AC220V±10%
• Power Consumption: 0.9kw (Processing); 0.8kw (Warming up)
• Transport Package: Standard Export Packing
• Specification: 775mm× 960mm× 1650 mm; 600kg
• Origin: China
• HS Code: 84862090
• Production Capacity: 200+ Sets/Year

Product Description