• Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
  • Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
  • Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
  • Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
  • Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
  • Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)

Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)

Application: Silicon, Gallium Arsenide, Ceramic, Glass, Alumina
Type: Fixed
Power Source: Servo Motor+Step Motor
Condition: New
Workpiece Size: Φ6’’ ≤160mm X 160mm
Groove Depth: ≤4mm
Customization:
Diamond Member Since 2010

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Basic Info.

Model NO.
DS616
Alignment System
70X Straight Light + Ring Light(210X Optional)
Spindle: Revolution Speed Range
3000~40000 Rpm
Spindle: Output Power
1.5kw
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.8kw (Processing); 0.7kw (Warming up)
Transport Package
Standard Export Packing
Specification
665mm× 850mm× 1650 mm; 500kg
Origin
China
HS Code
84862090
Production Capacity
200+ Sets/Year

Product Description

DS616 precision dicing machine uses DS-200 software control system with touch screen control so that the image alignment of workpiece is simple and convenient. The machine is equipped with high-power spindle and DD motor with higher accuracy that further enhance the dicing performance. DS616 is applicable to the cutting process of silicon, gallium arsenide, ceramic, glass, lithium niobate, alumina, quartz, sapphire, crystal and PCB in the application fields including diode, triode, MEMS, IC, LED, NTC, photovoltaic, medical device and scintillation crystal.

Features
  1. Constantly monitor spindle air pressure, hydraulic pressure and current to reduce spindle damage
  2. Cutting scope available on request
  3. Available for 160mm × 160mm square plate
  4. Optional image automatic recognition function
  5. Optional NCS function (non-contact height measurement)  
  6. Reasonable structure, easy maintenance, reducing fault
  7. High degree of automation
Specifications
 
Configuration and performance      Workpiece size Φ6" | 160mm x 160mm
Groove depth ≤4mm
Table flatness ±0.005mm/150mm
Alignment system 70x straight light + ring light(210x optional) 
Spindle Revolution speed range 3000~40000 rpm 
Output power 1.5kW
X axis Drive mode Servo motor
Max. stroke 240mm
Stroke resolution 0.001mm
Feed speed range 0.1~400mm/s
Y axis Drive mode Step motor + grating closed-loop control system
Max. stroke 170mm
Stroke resolution 0.0005mm
Single-step positioning accuracy ≤0.003mm/5mm
Index positioning accuracy ≤0.005mm/170mm
Z axis Drive mode Step motor
Max. stroke 30mm
Scale resolution 0.001mm 
Repeatability accuracy 0.002mm
Θ axis Drive mode DD motor
Max. rotating angle 380°
Angle resolution 0.0002° 
Basic specification Power supply Single phase, AC220V±10%
Power consumption 0.8kW (processing)
0.7kW (warming up)
Compressed air Pressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.0L/min
Cooling water Pressure: 0.2~0.4Mpa; flow rate: 1.5L/min
Exhaust air rate 2m3/min (ANR)
Overall dimensions W×D×H 665mm×850mm×1650 mm
Weight 500kg
 
Environmental Conditions
 
• Use clean, oil-free air (dew point below -15ºC, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature (fluctuations within ±1ºC).
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, blower, heat generation equipment or oil mist generating parts.
• Please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.

About US:
Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)
Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)

Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)


Certifications:
Precision Dicing Saw for Wafer Cutting of 6" Inch (DS616)

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