• Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
  • Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
  • Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
  • Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
  • Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
  • Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)

Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)

Application: Silicon, PCB, EMC, Ceramic, Glass, Lithium Niobate
Type: Fixed
Power Source: Servo Motor+Step Motor
Customization:
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Currency: US$
Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613) pictures & photos
Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
US $30,000-80,000 / Set
Min. Order: 1 Set
Diamond Member Since 2010

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Manufacturer/Factory

Basic Info.

Model NO.
DS613
Customized
Customized
Condition
New
Workpiece Size
Φ6’’ ≤160mm X 160mm
Groove Depth
≤4mm or Customize
Alignment System
70X Straight Light + Ring Light(210X Optional)
Spindle: Revolution Speed Range
3000~40000 Rpm
Spindle: Output Power
1.25kw
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.8kw (Processing); 0.7kw (Warming up)
Transport Package
Standard Export Packing
Specification
665mm× 850mm× 1650 mm; 500kg
Origin
China
HS Code
84862090
Production Capacity
200+ Sets/Year

Product Description

DS613 precision dicing machine uses DS-200 software control system, touch screen control and GUI interface so that the image alignment of workpiece is simple and convenient. DS613 has stable performance and low failure rate. DS613 is applicable to the cutting process of silicon, PCB, EMC, ceramic, glass, lithium niobate, quartz, sapphire, GaAs and crystal.

Features
  1. Self-check and alarm function of height measurement system
  2. Database management of workpiece and cutting blade
  3. Two-way blade lifting for cutting  
  4. Graphic alignment function
  5. Real-time display and early warning of blade edge exposure
Specifications
 
Configuration and performance      Workpiece size Φ6'' | 160mm x 160mm
Groove depth ≤4mm or customize
Table flatness ±0.005mm/100mm
Alignment system 70x straight light + ring light(210x optional) 
Spindle Revolution speed range 3000~40000 rpm 
Output power 1.25kW
X axis Drive mode Servo motor
Max. stroke 240mm
Stroke resolution 0.001mm
Feed speed range 0.1~400mm/s
Y axis Drive mode Step motor + grating closed-loop control system
Max. stroke 170mm
Stroke resolution 0.0005mm
Single-step positioning accuracy ≤0.003mm/5mm
Index positioning accuracy ≤0.005mm/170mm
Z axis Drive mode Step motor
Max. stroke 30mm
Stroke resolution 0.001mm 
Repeatability accuracy 0.002mm
Θ axis Drive mode Servo motor
Max. rotating angle 360°
Angle resolution 0.0005° 
Basic specification Power supply Single phase, AC220V±10%
Power consumption 0.8kW (processing)
0.7kW (warming up)
Compressed air Pressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.0L/min
Cooling water Pressure: 0.2~0.4Mpa; flow rate: 1.5L/min
Exhaust air rate 2m3/min (ANR)
Overall dimensions W×D×H 665mm×850mm×1650 mm
Weight 500kg
 
Environmental Conditions
 
• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.

About US:

Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)

Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)

Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)

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From payment to delivery, we protect your trading.
Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613) pictures & photos
Precision Dicing Saw for Wafer Cutting of Φ 6′ ′ Inch (DS613)
US $30,000-80,000 / Set
Min. Order: 1 Set
Diamond Member Since 2010

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory
Registered Capital
20000000 RMB
Management System Certification
ISO 9001, IATF16949