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China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer

Product Details
Application: Metal Saw, Blue Glass, Silicon, GaAs, PCB, Ceramic, Sapphire
Type: Fixed
Power Source: Servo Motor+Step Motor+Dd Motor
  • China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer
  • China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer
  • China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer
  • China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer
  • China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer
  • China OEM Factory 6" 8" 10" 12" Precision Dicing Saw for PCB, Silicon, Wafer
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Basic Info.

Model NO.
Dcing Saw 01
Customized
Customized
Condition
New
Workpiece Size
Φ200mm 180mm (for Square)
Groove Depth
≤4mm or Customize
Alignment System
70X Straight Light + Ring Light(210X Optional)
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650 mm; 600kg
Origin
China
HS Code
84862090
Production Capacity
200+ Sets/Year

Product Description

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