6" Dicing Saw Machine for Wafer Cutting High Percision CE

• Saw Type: Blade
• Application: Silicon, Gallium Arsenide, Ceramic, Glass, Alumina
• Type: Fixed
• Model NO.: DS616
• Power Source: Servo Motor+Step Motor
• Condition: New
• Workpiece Size: Φ6’’ ≤160mm X 160mm
• Groove Depth: ≤4mm
• Alignment System: 70X Straight Light + Ring Light(210X Optional)
• Spindle: Revolution Speed Range: 3000~40000 Rpm
• Spindle: Output Power: 1.5kw
• X Axis: Feed Speed Range: 0.1~400mm/S
• Y Axis: Single-Step Accuracy: ≤0.003mm/5mm
• Z Axis: Repeatability Accuracy: 0.002mm
• Power Supply: Single Phase, AC220V±10%
• Power Consumption: 0.8kw (Processing); 0.7kw (Warming up)
• Transport Package: Standard Export Packing
• Specification: 665mm× 850mm× 1650 mm; 500kg
• Origin: China
• HS Code: 84862090
• Production Capacity: 200+ Sets/Year

Product Description