• Super Precision Dicing Saw for Wafer Cutting (DS623)
  • Super Precision Dicing Saw for Wafer Cutting (DS623)
  • Super Precision Dicing Saw for Wafer Cutting (DS623)
  • Super Precision Dicing Saw for Wafer Cutting (DS623)
  • Super Precision Dicing Saw for Wafer Cutting (DS623)
  • Super Precision Dicing Saw for Wafer Cutting (DS623)

Super Precision Dicing Saw for Wafer Cutting (DS623)

Application: Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
Type: Fixed
Power Source: Servo Motor+Step Motor
Condition: New
Workpiece Size: Φ160mm ≤150mm X 150mm
Groove Depth: ≤4mm or Customize
Customization:
Diamond Member Since 2010

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Manufacturer/Factory

Basic Info.

Model NO.
DS623
Alignment System
70X Straight Light + Ring Light(240X Optional)
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw (2.4kw Optional)
X Axis: Feed Speed Range
0.1~500mm/S
Y Axis: Single-Step Accuracy
≤0.002mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.8kw (Processing); 0.7kw (Warming up)
Transport Package
Standard Export Packing
Specification
580mm× 850mm× 1680mm; 500kg
Origin
China
HS Code
84862090
Production Capacity
200+ Sets/Year

Product Description

DS623 super precision dicing machine uses the imported high-power DC spindle and performance is more excellent. The spindle has self-locking function and makes it much easier to replace the blade. DS623 is applicable to the cutting process of silicon, PCB, ceramic, glass, lithium niobate, alumina, quartz and sapphire.

Features
  1. With dual lens and higher alignment accuracy
  2. Broken Blade Detector (BBD)
  3. Grinding machine function
  4. Automatic edge-searching function
  5. Data scanning function
Specifications
 
Configuration and performance      Workpiece size Φ160mm | 150mm x 150mm
Groove depth ≤4mm or customize
Table flatness ±0.005mm/150mm
Alignment system 70x straight light + ring light (240x optional) 
Spindle Revolution speed range 10000~50000 rpm 
Output power 1.5kW (2.4kW optional)
X axis Drive mode Servo motor
Max. stroke 240mm
Stroke resolution 0.001mm
Feed speed range 0.1~500mm/s
Y axis Drive mode Step motor + grating closed-loop control system
Max. stroke 170mm
Stroke resolution 0.0001mm
Single-step positioning accuracy ≤0.002mm/5mm
Index positioning accuracy ≤0.004mm/170mm
Z axis Drive mode Step motor
Max. stroke 30mm
Stroke resolution 0.001mm 
Repeatability accuracy 0.002mm
Θ axis Drive mode  Imported DD motor
Max. rotating angle 380°
Angle resolution 0.0002° 
Basic specification Power supply Single phase, AC220V±10%
Power consumption 0.8kW (processing)
0.7kW (warming up)
Compressed air Pressure: 0.55~0.8Mpa; average flow rate: 450L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.5L/min
Cooling water Pressure: 0.2~0.4Mpa; flow rate: 1.5L/min
Exhaust air rate 1.5m3/min (ANR)
Overall dimensions W×D×H 580mm×850mm×1680mm
Weight 500kg
 
Environmental Conditions
 

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.

About US:
Super Precision Dicing Saw for Wafer Cutting (DS623)

Super Precision Dicing Saw for Wafer Cutting (DS623)

Super Precision Dicing Saw for Wafer Cutting (DS623)

Certification:
Super Precision Dicing Saw for Wafer Cutting (DS623)

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