• China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
  • China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
  • China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
  • China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
  • China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
  • China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB

China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB

Application: Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
Type: Fixed
Power Source: Servo Motor+Step Motor+Dd Motor
Customization:
Shipping Cost:

Estimated freight per unit.

about shipping cost and estimated delivery time.
Payment Method: visa mastercard discover JCB diners club american express T/T
  Initial Payment Full Payment
Currency: US$
Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB pictures & photos
China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
US $30,000-80,000 / Set
Min. Order: 1 Set
Diamond Member Since 2010

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory

Basic Info.

Model NO.
DS830
Customized
Customized
Condition
New
Workpiece Size
Φ200mm 180mm (for Square)
Groove Depth
≤4mm or Customize
Alignment System
80X Straight Light + Ring Light (40X 210X Optional
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw (2.2kw Optional)
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650mm; 600kg
Origin
China
HS Code
84862090
Production Capacity
200+ Sets/Year

Product Description

DS830 precision dicing machine uses the DS-300 software control system, imported high-resolution lens and camera to enhance graphics alignment accuracy and efficiency. DS830 is applicable to the cutting process of silicon, PCB, ceramic, glass, lithium niobate, alumina and quartz.

Features
  1. Graphical and simulative display of cutting process
  2. Water and gas curtain employed to reduce cutting powder residue
  3. Multi-angle water spray
  4. Broken Blade Detector (BBD) option
Specifications
 
Configuration and performance      Workpiece size Φ200mm | 180mm (for square)
Groove depth ≤4mm or customize
Table flatness ±0.005mm/150mm
Alignment system 80x straight light + ring light (40x 210x optional) 
Spindle Revolution speed range 10000~50000 rpm  
Output power 1.5kW(2.2kW optional)
X axis Drive mode Servo motor
Max. stroke 380mm
Stroke resolution 0.001mm
Feed speed range 0.1~400mm/s
Y axis Drive mode Step motor + grating closed-loop control system
Max. stroke 210mm
Stroke resolution 0.0005mm
Single-step positioning accuracy ≤0.003mm/5mm
Index positioning accuracy ≤0.005mm/210mm
Z axis Drive mode Step motor
Max. stroke 30mm
Stroke resolution 0.001mm 
Repeatability accuracy 0.002mm
Θ axis Drive mode DD motor
Max. rotating angle 380°
Angle resolution 0.0002° 
Basic specification Power supply Single phase, AC220V±10%
Power consumption 0.9kW (processing)
0.8kW (warming up)
Compressed air Pressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate 3.0L/min
Cooling water Pressure: 0.2~0.4Mpa; flow rate 1.5L/min
Exhaust air rate 1.8m3/min (ANR)
Overall dimensions W×D×H 775mm×960mm×1650 mm
Weight 600kg
 
Environmental Conditions
 

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.
About Us:
China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCBChina Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB

Certifications:
China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB

FAQ:
1.    Q: Are you manufacturer or trading company?
        A: We are manufacturer which focuses on pressure sensor for 33 years.
2.    Q: What international certificates do you have?
        A: ISO9001, CE, RoHS Certificated.
3.    Q: What is your production capacity?
        A: We produced 1500000 pieces pressure sensor in year 2017.
4.    Q: What is the lead time of your product?
        A: Stocks are available for some products. The typical lead time is 8~14 working days for product without customization. 
       Note: lead time may vary base on different products. Please contact us for detailed lead time. 
5.    Q: What is the warranty of your products?
       A: Our warranty time is 18 months after shipment.
6.    Q: Do you provide customized products?
       A: Yes, we can laser mark your logo, model and product information according to your requirement. We provide OEM and ODM service.


 

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From payment to delivery, we protect your trading.
China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB pictures & photos
China Factory Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 for LED, IC Chip, Ceramic, Silicon, PCB
US $30,000-80,000 / Set
Min. Order: 1 Set
Diamond Member Since 2010

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory
Registered Capital
20000000 RMB
Management System Certification
ISO 9001, IATF16949