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Precision Blade Dicing Saw Wafer Ceramic Glass Cutting

Product Details
Saw Type: Dicing Saw
Application: Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
Type: Fixed
  • Precision Blade Dicing Saw Wafer Ceramic Glass Cutting
  • Precision Blade Dicing Saw Wafer Ceramic Glass Cutting
  • Precision Blade Dicing Saw Wafer Ceramic Glass Cutting
  • Precision Blade Dicing Saw Wafer Ceramic Glass Cutting
  • Precision Blade Dicing Saw Wafer Ceramic Glass Cutting
  • Precision Blade Dicing Saw Wafer Ceramic Glass Cutting
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Basic Info.

Model NO.
Dicing saw DS830
Power Source
Servo Motor+Step Motor+Dd Motor
Customized
Customized
Condition
New
Workpiece Size
Φ200mm 180mm (for Square)
Groove Depth
≤4mm or Customize
Alignment System
80X Straight Light + Ring Light (40X 210X Optional
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw (2.2kw Optional)
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650mm; 600kg
Origin
China
HS Code
84862090
Production Capacity
300+ Sets/Year

Product Description

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