Precision Blade Dicing Saw Wafer Ceramic Glass Cutting

• Saw Type: Dicing Saw
• Application: Silicon, PCB, Ceramic, Glass, Lithium Niobate, etc
• Type: Fixed
• Model NO.: Dicing saw DS830
• Power Source: Servo Motor+Step Motor+Dd Motor
• Customized: Customized
• Condition: New
• Workpiece Size: Φ200mm 180mm (for Square)
• Groove Depth: ≤4mm or Customize
• Alignment System: 80X Straight Light + Ring Light (40X 210X Optional
• Spindle: Revolution Speed Range: 10000~50000 Rpm
• Spindle: Output Power: 1.5kw (2.2kw Optional)
• X Axis: Feed Speed Range: 0.1~400mm/S
• Y Axis: Single-Step Accuracy: ≤0.003mm/5mm
• Z Axis: Repeatability Accuracy: 0.002mm
• Power Supply: Single Phase, AC220V±10%
• Power Consumption: 0.9kw (Processing); 0.8kw (Warming up)
• Transport Package: Standard Export Packing
• Specification: 775mm× 960mm× 1650mm; 600kg
• Origin: China
• HS Code: 84862090
• Production Capacity: 300+ Sets/Year

Product Description